ISMP 2019

Amkor Technology is pleased to be presenting at ISMP 2019, being held within SEDEX 2019 in Seoul on October 8-11.

SungSoon Park, Sr. Director – R&D System Projects at Amkor Technology will be presenting “Advanced Packaging Technology for 5G, AI and Automotive”.

When: October 8, 2019 - October 11, 2019 장소: 대한민국 서울 Location: COEX Convention Center

또 다른 이벤트

TSMC Technology Symposium China 2024

APQ “Q OPENDAY”

Goldman Sachs Global Semiconductor Conference 2024