ISMP 2019

Amkor Technology is pleased to be presenting at ISMP 2019, being held within SEDEX 2019 in Seoul on October 8-11.

SungSoon Park, Sr. Director – R&D System Projects at Amkor Technology will be presenting “Advanced Packaging Technology for 5G, AI and Automotive”.

When: October 8, 2019 - October 11, 2019 開催地:ソウル、韓国 Location: COEX Convention Center

近日開催予定のイベント

IMAPS Symposium 2024

Packaging Chips with CHIPS: West Coast Summit

IEMT 2024