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ISIG Executive Summit Japan

Amkor Technology will be attending the ISIG Executive Summit Japan, a senior-level forum that convenes semiconductor executives and technology leaders to discuss the trends, opportunities and challenges shaping the future of the semiconductor industry. The event will take place December 2–3, 2026, at the Hilton Tokyo Odaiba in Tokyo, Japan. The summit features strategic discussions focused on advanced semiconductor manufacturing, packaging innovation, supply chain collaboration and the technology trends enabling next-generation applications.

At the summit, Shinji Baba, Vice President, Research & Development, will present “Advanced Power Module Packaging Technologies and Amkor Japan Overview.” Additional information about the presentation will be provided at a later date.

By working closely with customers, partners, and industry leaders across the semiconductor ecosystem, Amkor helps drive packaging innovation, strengthen supply chain collaboration and support the technologies enabling the next generation of semiconductor applications while advancing what’s next.