IMAPS MiNaPAD Forum 2018
Amkor Technology invites you to join us at the IMAPS MiNaPAD Forum on May 16-17 in Grenoble, France at the World Trade Center.
The MiNaPAD Conference is the major electronics packaging, interconnection and integration conference in France.
André Cardoso, R&D Integrator at Amkor, will be presenting “Studies of the Electromigration Effect in RDL of Wafer-Level Fan-In and Fan-Out Packaging Using a Novel Analysis Approach” on Wednesday, May 16th at 16:50 during Session G: Wafer Level Packaging.
Amkor 将在此活动中和在场的封装专家一道进行演示，回答问题并讨论您的 IC 封装需求。