IMAPS MiNaPAD Forum 2018

Amkor Technology invites you to join us at the IMAPS MiNaPAD Forum on May 16-17 in Grenoble, France at the World Trade Center.

The MiNaPAD Conference is the major electronics packaging, interconnection and integration conference in France.

André Cardoso, R&D Integrator at Amkor, will be presenting “Studies of the Electromigration Effect in RDL of Wafer-Level Fan-In and Fan-Out Packaging Using a Novel Analysis Approach” on Wednesday, May 16th at 16:50 during Session G: Wafer Level Packaging.

Amkor 将在此活动中和在场的封装专家一道进行演示,回答问题并讨论您的 IC 封装需求。

When: May 16, 2018 - May 17, 2018 Where: Grenoble, France Location: World Trade Center (WTC)

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