IMAPS MiNaPAD 포럼 2018
Amkor Technology invites you to join us at the IMAPS MiNaPAD Forum on May 16-17 in Grenoble, France at the World Trade Center.
The MiNaPAD Conference is the major electronics packaging, interconnection and integration conference in France.
André Cardoso, R&D Integrator at Amkor, will be presenting “Studies of the Electromigration Effect in RDL of Wafer-Level Fan-In and Fan-Out Packaging Using a Novel Analysis Approach” on Wednesday, May 16th at 16:50 during Session G: Wafer Level Packaging.
앰코 패키징 전문가들과의 질의응답 시간을 통해 궁금증을 해소하고 IC 패키징의 미래를 논의하시기 바랍니다.