Please join Amkor Technology and the AZ IMAPS Chapter for the next Luncheon Presentation on Wednesday, May 16th, 2018 at the Holiday Inn & Suites in Mesa, Arizona.
Mike Kelly, VP, Advanced Package Technology Integration at Amkor Technology will be presenting:
“Heterogeneous IC Packaging for High Performance”
Recently, demands for ever increasing logic die sizes, more in-package memory, such as High Bandwidth Memory 2 (HBM2) have promoted a fresh look at heterogeneous integrated circuit (IC) packaging. Package sizes more than 100 x 100 mm are on the drawing boards. Application specific integrated circuit (ASIC) and processor sizes continue to grow pushing full reticle sizes, even into 7-nm processes. Memory package capacity and bandwidth demands appear insatiable, and new combinations of logic-logic and logic-memory-IO configurations to enable IP reuse are in design phases now. The goal for heterogeneous packaging is to enable this package level integration at a compelling performance and cost intersection.
Mike joined Amkor in 2005 and has led package developments for EMC shielding, thermally enhanced PBGAs, image sensors and most recently 2.5D TSV and high density fan-out development for multi-die packages. He previously worked for HP. Mike has worked in circuit board and IC package design and manufacturing for 24 years, managing projects ranging from polyester flexible circuits to flip chip, and management of IC package design and signal integrity teams. Mike holds master’s degrees in Mechanical and Chemical Engineering.