ECTC 2019

Amkor Technology invites you to join us at ECTC 2019 on May 28 – May 31 in Las Vegas, Nevada at the Cosmopolitan. ECTC is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

Rajen Dias, Director – Advanced Products Development at Amkor, will be presenting “Lead-Free, High Thermal and Electrical Performance Driven Die Attach Material Development for Power Packages

Amkor will be exhibiting at this event with our packaging experts on hand to answer questions and discuss your IC packaging needs.

When: May 28, 2019 - May 31, 2019 Where: Las Vegas, Nevada Location: The Cosmopolitan of Las Vegas


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