Amkor Technology invites you to join us at ECTC 2019 on May 28 – May 31 in Las Vegas, Nevada at the Cosmopolitan. ECTC is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.
Amkor is presenting the following:
Wednesday, May 29, 8:00-11:40 AM
Session 4: Advancements in Automotive and Power Devices
10:00 AM – “Challenges and Approaches to Developing Automotive FCBGA Grade 1/0 Package Capability” Rajen Dias – Amkor Technology, Inc.; Mike Kelly, Devarajan Balaraman, KwangSeok Oh, JoonYoung Park, Hideaki Shoji, Tomio Shiraiwa – Amkor Technology, Inc.
Friday, May 31, 1:30-5:10 PM
Session 31: Automotive and Power Packaging
4:45 PM – “Pb-Free, High Thermal and Electrical Performance Driven Die Attach Material Development for Power Package” Byong Jin Kim, DongSu Ryu, Hyeong Il Jeon, Weng Tuck Chim, JinYoung Khim, Muhammad Hadhari Hazellah – Amkor Technology, Inc.
Friday, May 31, 2019
Session 41: Student Interactive Presentations
Time: 8:30 AM – 10:30 AM
“Effects of NCF and UBM Materials on Electromigration Reliabilities of Sn-Ag Microbumps for Advanced 3D Packaging” Kirak Son, Gahui Kim, Hyodong Ryu, Young-Cheon Kim, Jeong Sam Han, Young-Bae Park – Andong National University; Gyu-Tae Park – Amkor Technology, Inc.; Ho-Young Son, Nam-Seog Kim – SK Hynix Inc.; Cheol-Woong Yang – Sungkyunkwan University
Amkor will be exhibiting at Booth #305 with our packaging experts on hand to answer questions and discuss your IC packaging needs.