活动

CSIA-ICCAD 2022

Join Amkor Technology at the upcoming CSIA-ICCAD conference on December 26-27, 2022 at the Xiamen International Convention and Exhibition Center in Xiamen, China. Amkor will be exhibiting with our packaging experts on hand to answer questions and discuss your IC packaging needs.

Amkor Technology 大中华区销售副总监 Bibby Wang 将发表题为“Heterogeneous IC Packaging, Optimizing Performance and Cost”的演讲。