Join Amkor Technology at the upcoming CSIA-ICCAD conference on December 26-27, 2022 at the Xiamen International Convention and Exhibition Center in Xiamen, China. Amkor will be exhibiting with our packaging experts on hand to answer questions and discuss your IC packaging needs.

Amkor Technologyで中国セールスのデピュティ・ディレクターを務めるBibby Wangが、「Heterogeneous IC Packaging, Optimizing Performance and Cost(異種ICパッケージング、パフォーマンスとコストの最適化)」のタイトルで講演を行います

When: December 26, 2022 - December 27, 2022 会場:Xiamen International Convention and Exhibition Center 開催地:中国、厦門市


ISES EU Power 2024

MEMS World Summit Europe 2024

TSMC Technology Symposium Japan 2024