活动

UCLA CHIPS Symposium 2025

Amkor Technology is excited to participate in the 2025 UCLA CHIPS Symposium, taking place December 4, 2025, at the UCLA Samueli School of Engineering in Los Angeles, California.

David McCann, Senior Vice President and Chief of Staff – Business Units, will present “On-shore Packaging at Amkor” from 11:15 to 11:45 a.m. in the Cohen and Mong Auditorium, Engineering Building No. 6.

The presentation will cover Amkor’s leadership in advanced packaging solutions and its commitment to strengthening domestic semiconductor manufacturing. Attendees will learn about on-shore packaging strategies and their role in supporting the U.S. semiconductor ecosystem.

We invite attendees to connect with the Amkor team to discuss the latest packaging technologies and explore opportunities for collaboration at the UCLA CHIPS Symposium.