Amkor is proud to participate in the upcoming 2019 Yole Développement and NCAP Advanced Packaging & System Integration Technology Symposium taking place at the Grand Mercure Shanghai Century Park Hotel, on April 22 – 23.
John Lee, Sr. Director, Strategic Marketing – Greater China, will deliver a presentation on “High-Performance Packaging for AI”.
“Higher performance SoC (CPU, GPU, FPGA, ASIC), chiplets and High Bandwidth Memory (HBM) have been introduced to high-performance computing for the raising AI, machine learning and deep learning applications. This brings big challenges to package technology, such as higher power consumption, larger die size and larger package size, better electrical SI/PI, higher density connection, etc. This is also driving various package evolution from the structure, process, materials and even design methodology. This presentation will discuss Amkor’s high-performance package solutions, including single chip FCBGA, multi-chip module FCBGA, HDFO (High-Density Fan-Out) and 2.5D Heterogeneous packages for the coming era of AI.”