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SEMI Advanced Packaging Summit 2026

Amkor Technology will participate in Advanced Packaging Summit 2026, a SEMI event focused on the latest developments in advanced packaging technologies and their role in enabling next-generation semiconductor innovation. The event will take place on July 15, 2026, at Convention Hall 1, 3F, Suwon Convention Center in Suwon, South Korea.

As part of the conference program, Shinji Baba, Vice President, R&D Center, Amkor Technology Japan, Inc., will present “Advanced Power Module Packaging Technologies.” His session will highlight recent trends in power devices and power module packaging, covering the key electrical and thermal challenges, representative solutions such as advanced interconnects, cooling architectures, and embedded power modules, and Amkor’s technology roadmap.

Amkor looks forward to engaging with customers and industry partners at Advanced Packaging Summit 2026 to share insights into power module packaging technologies and discuss how its expertise supports the evolving needs of automotive and industrial electrification.