Amkor Technology 在 CISES 2021 上荣获 “Packaging House of the Year” 奖项
Amkor Technology was awarded “Packaging House of the Year” on Tuesday, October 12, 2021, during the China International Semiconductor Executive Summits (CISES 2021) in Shanghai, China.
该奖项证明我们的全球合作伙伴对 Amkor 能够为半导体行业的全部客户大批量提供最具创新的高质量封装与测试服务的信任和信心。
要了解关于 CISES 的更多信息，请访问 Chinasemiconsummit.com/
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