Amkor Technology Was Awarded “Packaging House of the Year” at CISES 2021
Amkor Technology was awarded “Packaging House of the Year” on Tuesday, October 12, 2021, during the China International Semiconductor Executive Summits (CISES 2021) in Shanghai, China.
This recognition confirms the trust and confidence that our global partners have in Amkor, to deliver the most innovative packaging and test services in high volume with superior quality to all customers in the semiconductor industry.
Learn more about CISES, visit Chinasemiconsummit.com/
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