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Amkor Technology made a significant impact at this year’s IMAPS Device Packaging Conference held March 2-7 in Phoenix, Arizona. The company’s booth drew industry professionals interested in exploring the latest advancements in Amkor’s packaging technology and collecting popular promotional items.

The conference provided an excellent platform for Amkor to demonstrate its thought leadership in advanced packaging and test solutions. Attendees were visibly impressed by the new S-Connect™ Technology Overview video, which showcases how S-Connect™ seamlessly integrates multiple silicon dies within a single package, enabling enhanced performance, flexibility and miniaturization.

Mike Kelly, VP of Chiplets/FCBGA Business Unit, joined industry experts for TechSearch’s evening panel “Preparing for the Coming AI Winter,” offering valuable insights on industry challenges and opportunities. Meanwhile, Vineet Pancholi, Sr. Director of Test Technology, attracted consistent crowds with his poster presentation on “2.5D Advanced Package Test Services.”

Amkor’s technical presence was felt throughout the conference with six innovative presentations:

• “Chiplets and Advanced IC Packaging: Evolution and Tradeoffs” by Mike Kelly
• “Firewalls in Semiconductor Assembly” by Prasad Dhond, VP, Wirebond BGA & MLF BU
• “A Novel Package Structure for Enhancing Power Integrity Performance and Cost Efficiency” by MinWon Park, Director, Process/Material Research
• “A Large Body Lidded FCBGA Thermal Performance Study with Indium-Silver Alloy TIM” by YoungDo Kweon, Sr. Director, Chiplets/FCBGA BU
• “Small Form Factor MEMS & Sensor Packages” by Lawrence Natan, Sr. Manager, MEMS and Sensor BU
• “A New Optical Packaging Platform for Automotive Optical Sensors” by Weilung Lu, Sr. Director, MEMS and Sensor

At the exhibition booth, two stylish Amkor portable chairs with built-in drink coolers were raffled off. Each included a refreshing six-pack of Amkor’s very own yuzu-mint citrus soda. Congratulations to our winners: Mancy Huang of USSEMI and Riku Shimzu of Lintec.

The competition heated up during the 3DInCites Back Yard Olympics, where Amkor’s team—comprising MinWon Park, Brad Moore, Bryce Lukehart and Suresh Jayaraman—secured the silver medal after competing in cornhole, golf chipping, axe throwing, ring toss and water pong. As sponsors of this popular event, Amkor delighted attendees with branded beverages—including beer and espresso martinis featuring the company’s logo printed on the foam—which proved to be a significant crowd favorite!

A special thanks to our dedicated team of experts who engaged with attendees and provided technical insights throughout the event. IMAPS DPC 2025 was a resounding success for Amkor, helping us deepen existing customer relationships, forge new connections, and reinforce our position at the forefront of semiconductor packaging and test innovation.