Blog

Amkor recently made a big impression at the International Microelectronics Assembly and Packaging Society (IMAPS) Device Packaging Conference (DPC) held from March 19-21 in Fountain Hills, Arizona. Our booth saw record attendance as attendees gathered to check out Amkor’s latest innovations and grab some of our popular swag items.

The conference provided an excellent platform for Amkor to showcase our thought leadership in advanced packaging and test solutions. We had a strong presence across the technical programs.

Mike Kelly, VP of Chiplets/FCBGA Technology Integration, participated in the evening panel “Looking for the Next Killer Application: Will Heterogeneous Integration be the Enabler?” on March 19.

During the IMAPS Poster Session on March 20, Amkor featured four innovative papers:

• “High Thermal Performance Thermal Interface Material (TIM) for Advanced Semiconductor Products” by YoungDo Kweon
• “Low-Cost Solution for Thermally Enhanced, Heat-Spreader ChipArray^® BGA (CABGA) Packages” by KyungSu Kim
• “Pursuing Optimal Cost of Ownership in Leadless Leadframe Packaging” by Mike Flatley & Brad Moore
• “Amkor In-house Test Solutions” by Vineet Pancholi

On March 21, Mike Kelly delivered a presentation titled “Chiplets and Heterogeneous IC Packaging: Building Blocks and Tradeoffs” as part of the Heterogeneous 2D & 3D Integration track.

A big thank you to our dedicated team of experts who spent time engaging with attendees and providing technical insights at the Amkor booth: Blake Lukehart, Brad Moore, Chandrashekar Pendyala, Corey Koehler, Curtis Zwenger, Danny Brady, Drake Miller, Kyung Su Kim, Luke Lindholm, Mike Flatley, Paul Silvestri, Prasad Dhond, Suresh Jayaraman, Tyler DeHaan, Vineet Pancholi, and YoungDo Kweon.

IMAPS DPC 2024 was a resounding success for Amkor. We deepened existing customer relationships, forged new connections, and are proud to be at the forefront of innovation in semiconductor packaging and test.