Amkor Joins TSMC’s OIP 3DFabric™ Alliance

November 10, 2022 in Company News by Amkor Marcom

TSMC 3DFabric Award Acceptance

Amkor Technology welcomes the creation of TSMC’s OIP 3DFabric Alliance as a catalyst for closer collaboration among multiple partners from design to advanced packaging, assembly and test. OSATs are a critical extension of TSMC’s manufacturing and enable the optimization of IC performance, power and area (PPA). Amkor is honored to join this Alliance to support industry growth vectors, such as High-Performance Computing (HPC), Artificial Intelligence (AI), networking and wireless communications.

As the industry’s most comprehensive and vibrant ecosystem, the TSMC OIP consists of six alliances: the EDA Alliance, IP Alliance, Design Center Alliance (DCA), Value Chain Alliance (VCA), Cloud Alliance and now the 3DFabric Alliance. TSMC launched OIP in 2008 to help customers overcome the rising challenges of semiconductor design complexity by creating a new paradigm of collaboration, organizing development and optimization across TSMC’s technologies, electronic design automation (EDA), IP and design methodology.

Partners of the new 3DFabric Alliance have early access to TSMC’s 3DFabric technologies, enabling them to develop and optimize their solutions in parallel with TSMC. This gives customers a head start on their product development with early availability of the highest-quality, readily-available solutions and services from EDA and IP to DCA/VCA, Memory, OSAT (Outsourced Semiconductor Assembly and Test), Substrate and Testing.

Visit the 3DFabric Alliance website to learn more.