PowerCSP™

Electrical and thermally-enhanced power package

PowerCSP™ is an innovative chip scale power transistor package. It has a simple structure, excellent electrical and thermal properties, and a high-density form factor that suits the challenges of discrete or integrated packaging.

This package features:

• A high percent of conductive material within the volume of the package of 30-70%
• CMOS, GaN and SiC compatible
• Custom and standard pin layouts in a dual-sided power package
• Direct connection of the source or drain to the PCB
• Integrated power building block
• Low resistance (Rds), low inductance (Lds), and good capacitive (Ciss) performance compared to other discrete packages
• Reduced thermal and electrical interfaces
• Reduced form factor, Chip Scale Package (CSP)

New Developments

• Eliminates lossy interfaces compared to traditional discrete packaging
• Maximized source and drain connectivity area
• Simple package structure eliminates clip and wire for a direct source/drain/gate connection