유연한 설계 매개변수로 성능 및 비용 최적화하다.

앰코의 Plastic Ball Grid Array (PBGA)는 가격 대비 성능이 뛰어난 애플리케이션을 위해 최첨단 어셈블리 공정 및 설계를 포함하고 있습니다.

PBGA packages are designed for low inductance, improved thermal operation and enhanced Surface Mount Technology (SMT) ability. This advanced IC package technology allows application and design engineers to optimize innovations while maximizing the performance characteristics of semiconductors. Custom performance enhancements, like ground and power planes, are available for significant improvements in electrical response demanded by advanced electronics. Additionally, these packages utilize industry proven, semiconductor grade materials for reliable, long-term operations while providing user flexible design parameters.

앰코 PBGA의 통합 설계 기능은 많은 디바이스에서 향상된 성능을 제공하므로 microprocessors/controllers, ASICs, gate arrays, memory, DSPs, PLDs, graphics and chipsets에 이상적인 패키지입니다. 앰코 PBGA의 여러 특성은 휴대전화, 무선통신, PCMCIA 카드, GPS (Global Positioning System), 컴퓨팅, 비디오 카메라, 스토리지 드라이브 및 기타 유사제품 등, 향상된 휴대성, form factor/크기 및 고성능을 요구하는 애플리케이션에 아주 유용합니다.

특징

  • Custom ball counts to 1521
  • 1.00, 1.27 & 1.50 mm standard ball pitch available, other ball pitches available upon request (예 : 0.8 mm)
  • 17 mm에서 40 mm의 패키지 크기
  • Thin Au wire (0.5mil) or Cu wire compatible
  • Chip-on-Chip (CoC)
  • Large mold cap for quality enhancement
  • Low profile and lightweight
  • Thermal and electrical enhancement capable
  • Highly flexible internal routing of signal, power, and ground for device performance and system compatibility
  • HDI designs possible

  • Suitable substrate for multi-die (MCM) and integrated SMT structures
  • Mature strip based manufacturing process with high yields
  • Full in-house design capability
  • Quickest design-to-prototype delivery
  • Perimeter, stagger and full ball arrays
  • Special packaging for memory available
  • Multi-layer, ground/power
  • JEDEC MS-034 standard outlines
  • 우수한 신뢰성
  • 63Sn/37Pb or Pb-free solder balls
  • Automotive AEC-Q100 Compliance

Q & A

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