전기적 성능이 향상된 소형 form factor

Amkor’s Flip Chip CSP (fcCSP), a flip chip solution in a Chip Scale Package (CSP) format. The advantages of flip chip interconnect are multiple: it provides enhanced electrical performance over standard wirebond technology, allows for a smaller form factor due to increased routing density, and eliminates wire-bond loops.

fcCSP is based on Amkor’s proprietary ChipArray® BGA (CABGA) package construction, using cutting-edge thin core laminate substrates. The package is assembled in strip format, in either bare die or overmolded format, and saw singulated for manufacturing efficiency and cost minimization. Pattern plating for fine line/spaces, via-in-pad substrate structure, and thin core substrate panel processing allow for increased routing density and enhanced electrical performance, making fcCSP an attractive option for advanced CSP applications where electrical performance is a critical factor.

fcCSP 패키지는 성능뿐만 아니라 패키지 크기가 중요한 손안에 휴대가 가능한 전자제품을 위한 매력적인 선택 옵션입니다. 고성능 단말기, 서버, 데이터 통신 제품 및 전기적 성능이 중요한 RF 애플리케이션에 사용되고 있습니다. wirebond loops를 제거하면 die에 대한 저항이 낮아지고 routing density가 높아지므로 중요한 고주파 신호 라인에 최적화된 전기경로를 사용할 수 있게 됩니다.

특징

  • Can design to high-frequency applications of 60+ GHz
  • 9–1500ball counts
  • Array strip production
  • Thin core laminate or buildup substrate construction
  • Bare die with underfill, overmolded, molded underfill and exposed die molded versions available
  • Accommodates package sizes from 2–17 mm
  • Flip chip bump pitches of 80μm peripheral and 130μm area array
  • Cu pillar flip chip interconnects for fine bond pitches down to 30 μm/60 μm staggered
  • Available in 0.4–1.0 mm BGA ball pitch, as well as Land Grid Array (LGA) interconnect

  • Minimum package thickness of < 0.4 mm for LGA interconnect, < 0.6 mm for 0.4 mm and 0.5 mm BGA pitch
  • Turnkey solution – design, bumping, bumped wafer probe, backgrind, assembly, and test
  • Much better signal to noise ratio at higher frequencies (>1 GHz) versus wirebonded packages
  • Low inductance of flip chip bumps – short, direct signal path
  • Flexible customizable substrate routing. Smaller possible body size than wirebond CSP due to additional space not required for wirebond pads

Q & A

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