표준적이면서 열적으로 성능이 향상된 패키지
Amkor’s Metric Quad Flat Pack (MQFP) offers customers a legacy package with updated materials that extend the life of older board designs. The heat spreader option expands design margins on thermally challenging designs.
Amkor employs up-to-date materials and processes to assure a successful, reliable performance of IC chips providing security and convenience. Some MQFP designs and applications require an added margin of thermal performance (power). Amkor’s easy and cost-effective solution is a heat spreader. This optional embedded thermal aid improves Theta JA as much as 15% (without external heat sinks or fans) by supplementing the heat dissipation path from the IC chip to the printed circuit board.
Amkor’s MQFP line is adapted to meet the increasing challenges of microcontrollers, analog controllers, ASICs, and other technologies. These packages fill application needs in consumer, commercial, office, automotive, PC, industrial and other product areas.
- 10 x 10mm에서 28 x 28mm의 패키지 크기
- 44–280의 lead 개수
- A broad selection of die pad sizes on open-tooled leadframes
- Die-up and down configurations
- 전도도 높은 copper leadframe 사용
- 표준 JEDEC 패키지 규격
- heat spreader를 사용한 열 성능 개선 가능
- 고객맞춤형 leadframe 설계 가능
- Fine pitch wire bond capability
Q & A
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