칩 스케일 패키지 근처 리드프레임 기판 적용된플라스틱

Amkor’s MicroLeadFrame® (MLF®|MLP|LFCSP|VQFN|SON|DFN|QFN – Quad Flat No-Lead package) is a near Chip Scale Package (CSP), plastic encapsulated with a copper leadframe substrate. This package uses perimeter lands on the bottom of the package to provide electrical contact to the Printed Wiring Board (PWB).

The MicroLeadFrame package also offers Amkor’s ExposedPad technology as a thermal enhancement. Having the die-attach paddle exposed on the bottom of the package surface provides an efficient heat path when soldered directly to the PWB. This enhancement also enables stable ground using down bonds or by electrical connection through a conductive die attach material.

The small size and weight along with excellent thermal and electrical performance make the MicroLeadFrame package an ideal choice for handheld portable applications such as smartphones and tablets or any other application where size, weight and package performance are required.

특징

  • Small size (reduce footprint by 50% or more and improved RF performance) and weight
  • 표준 leadframe 공정 순서 및 장비
  • 우수한 열적, 전기적 성능
  • 최대 높이 0.35 mm~1.45 mm
  • I/O 수 범위: 기존 MLF에서 1~180, rtMLF에서 200 이상
  • 1–13 mm의 패키지 크기
  • 얇은 패키지 프로필과 우수한 제품 크기 대비 die 크기 비율
  • 무연, 친환경
  • 에칭된 leadframe을 사용한 유연한 설계
  • Saw and punch versions available

MLF 유형

  • Chip-on-Lead (COL)
  • Single row (up to 108 I/O)
  • Dual row (up to 180 I/O)
  • 멀티칩 패키지 (MCP)
  • Non-exposed pad
  • Punch & saw 마이크로 리드프레임 선택 가능
  • Small MLF (Less than 2 x 2의 패키지 크기)

  • Stacked die
  • Thin MicroLeadFrame
  • Flip Chip MLF (fcMLF)
  • Routable MLF (rtMLF)
  • Wettable flanks (PEL)
  • 센서용 비자성 리드프레임
  • 향상된 유연성과 I/O 갯수를 위한 분할 패드 설계
  • Edge ProtectionTM Technology

Q & A

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