더 작은 패키지와 향상된 기능으로 고집적된 제품 생산
Semiconductor industry demands for higher levels of integration and lower costs coupled with a growing awareness of complete system configuration have continued to drive the popularity of System in Package (SiP) solutions. Amkor’s SiP technology is an ideal solution in markets that demand a smaller size with increased functionality. By assembling, testing and shipping millions of SiP devices per day, Amkor Technology has a proven track record as the industry leader in SiP design, assembly and test.
Amkor’s Center of Excellence for substrate-based SiP technology is located in our largest volume manufacturing facility in ATK4 Kwangju, South Korea. The large-scale manufacturing capabilities in ATK4 factory can achieve significant volume production support with very high yields with short cycle times.
System in Package technology allows multiple advanced packaging technologies to be combined to create solutions customized to each end application. Laminate based SiP technology is in a front-runner solution and most popular SiP solution for cellular, IoT, power, automotive, networking and computing system integrations.
기존 시장에서 SiP의 용도는 다음과 같습니다.
- RF and wireless devices
Power amplifiers, front end module, antenna switch, GPS/GNSS modules, cellular handset and cellular infrastructure, Bluetooth® solutions and 5G NR
- 웨어러블과 사물통신(M2M)을 위한 IoT
Connectivity, MEMS, microcontroller, memory, antenna, PMIC and other mix-mode devices
- 자동차 애플리케이션
인포테인먼트 및 센서 모듈
- Power Modules
DC/DC 컨버터, LDO, PMIC, 배터리 관리 및 기타
- 로직, 아날로그 및 혼합 모드 기술
태블릿, PC, 디스플레이 및 오디오
- 컴퓨팅 및 네트워킹
5G 네트워킹 및 모뎀, 데이터 센터, 저장고와 SSD
Q & A
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