Amkor Technology invites you to join us at the Wafer Level Packaging Symposium (WLPS) on February 15-17, 2022 being held at the DoubleTree by Hilton San Jose in San Jose, California.

Suresh Jayaraman, Sr Director, Advanced Package Development and Integration at Amkor will present “Advanced Packaging: HDFO for Next-Generation Devices.

When: February 15, 2022 - February 17, 2022 Where: DoubleTree by Hilton San Jose Location: San Jose, California

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