Amkor Technology is a proud sponsor of ICDIA 2023 being held on July 13-14, 2023 at the Worldhotel Grand Juna Wuxi. Yufeng Huang, Sr. Manager, Technical Program Management (TPM) at Amkor Technology China will present “Automotive Semiconductor Packaging-Market & Technology Dynamics”
Autonomous driving is expected to change the human transportation model and rebuild the entire automotive industry economy. With the upcoming 2020~2023 SAE Level 3 implementation in automakers’ timelines, a significant increase in ADAS semiconductor content demand can be expected. This will drive hardware system architectural evolution and demand for various new chips, including mmWave radar, sensor fusion chips, real-time processing of an enormous volume and variety of vision and radar data, domain control units integrating numerous ECUs, heterogeneous chip hardware solutions, and more.
With more than 40 years of automotive package assembly and test experience, Amkor offers advanced packages including fcCSP, FCBGA, SiP and Low- and High-Density Fan-Out (HDFO) to support customers in these emerging applications. As the leading automotive OSAT, Amkor provides turnkey solutions including design, process and test to satisfy strict automotive device qualifications by using dedicated production lines with special production control plans.
Yufeng Huang joined Amkor in 2016 and is currently responsible for technical program management. Before joining Amkor, Yufeng Huang worked for ASE. He came to Amkor with 12 years of OSAT, focused on process, and NPI development in assembly. He holds a BS degree in Electronic Material from Shanghai University.