Events

ECTC 2025

Join Amkor Technology at ECTC 2025, May 27-30 at the Gaylord Texan Resort & Convention Center in Dallas, Texas.

Featured Technical Presentation:

“Low Loss, High Reliability (LLHR) Package on a 650 mm x 650 mm Hybrid Panel-Level Package (PLP) Platform”
Presented by Eoin OToole, R&D Director, Amkor Technology Portugal

Visit our exhibit booth to meet with our packaging experts and discuss your IC packaging solutions.