Events

Chiplet Summit 2025

Amkor Technology invites you to the Chiplet Summit 2025 from January 21-23 at the Santa Clara Convention Center in Santa Clara, California. As a proud Bronze sponsor, we are excited to announce that Mike Kelly, our VP of Chiplets/FCBGA Integration, will speak in session E-102: “Best Packaging Methods for Your Application.”

This session will feature a distinguished panel of experts in semiconductor packaging, including:

• Akshay Singh, VP of Advanced Packaging Technology Development at Micron
• Craig Bishop, CTO of Deca Technologies
• Chintan Buch, Senior Member of Technical Staff Packaging at AMD
• Kenneth Larsen, Director of Product Management at Synopsys

Rosalia Beica, Field CTO at Rapidus Design Technologies will moderate the discussion.

Roger St Amand, Corporate vice president of Chiplets/FCBGA, will present “Chiplet Packaging Basics.” This presentation will cover the fundamentals of chiplets and heterogeneous integration and highlight the high-level process flows of Amkor’s 2.5D, S-SWIFT™, and S-Connect™ package technologies.

Vineet Pancholi, Sr Director, Test Technology, will present “Best Practices for Testing 2.5D Chiplet Package Designs.” The presentation will focus on the need for comprehensive test integration throughout development and the continuing significance of system-level testing in manufacturing processes.