Chiplet Summit 2025
Amkor Technology invites you to the Chiplet Summit 2025, taking place from January 21-23 at the Santa Clara Convention Center in Santa Clara, California. As a proud Bronze sponsor, we are excited to announce that Mike Kelly, our VP of Chiplets/FCBGA Integration, will be speaking in session E-102: “Best Packaging Methods for Your Application.”
This session will feature a distinguished panel of experts in semiconductor packaging, including:
- Akshay Singh, VP of Advanced Packaging Technology Development at Micron
- Craig Bishop, CTO of Deca Technologies
- Chintan Buch, Senior Member of Technical Staff Packaging at AMD
- Kenneth Larsen, Director of Product Management at Synopsys
The discussion will be moderated by Rosalia Beica, Field CTO at Rapidus Design Technologies.
Additionally, Roger St Amand, Corporate VP of Chiplets/FCBGA, will be presenting “Chiplet Packaging Basics.” This presentation will cover the fundamentals of chiplets and heterogeneous integration, highlighting high-level process flows of Amkor’s 2.5D, S-SWIFT™, and S-Connect™ package technologies.
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