Events

Arizona Chapter IMAPS Technology Luncheon

Amkor Technology is proud to host the upcoming Arizona Chapter IMAPS Technology Luncheon on Monday, June 26, 2023, at our headquarters located in Tempe, Arizona. Cameron Nelson, Sr. Manager, Advanced Package Development & Integration at Amkor will be presenting “Package Integrated Vapor Chamber Heat Spreaders.” The registration deadline is Friday, June 23.

About the presentation:

With continuous increases in computational demand in nearly all semiconductor market segments, even historically lower power packaging is being driven into challenging thermal management situations. The development of high-performance system cooling solutions to support these demands has resulted in the package now comprising a much larger percentage of the total system thermal budget. In FCBGA packages that require the protection and mechanical benefits of an integrated heat spreader, a package integrated vapor chamber heat spreader can offer significant thermal enhancement compared to a pure copper heat spreader. A vapor chamber is a type of two-phase passive heat transfer device that can achieve an effective thermal conductivity of more than 20 times greater than that of copper. This presentation will cover the fundamentals of packaging thermal management and introduce Amkor’s latest developments in advanced packaging thermal enhancement with vapor chamber lids.

About the speaker:

Cameron Nelson joined Amkor in 2010 and currently serves as a Senior Manager, specializing in advanced package development for fcCSP, HDFO, 2.5D, and 3D packaging. He has extensive experience in packaging thermal management and in a previous role has managed Amkor’s thermal characterization lab. Recognized for his outstanding contributions to the field, he has been honored with the prestigious Harvey Rosten Award for Excellence in the Physical Design of Electronics for his work on advanced characterization methods for thermal interface materials. Cameron holds a Bachelor of Science degree in Mechanical Engineering from Arizona State University.

Event information:

Amkor is hosting this luncheon at its corporate headquarters at 2045 E Innovation Circle, Tempe, Arizona  85284. The event starts promptly at 11:30 AM and the presentation begins at noon. Lunch will be provided to attendees.

Registration Fees:

• IMAPS Member – $20
• Nonmember – $25
• Students – $10

Sponsorship:

Event sponsorship is only $150 and includes (a limit of one per event)

• Two registrations
• Logo on Arizona Chapter website
• Recognition at the event

Questions?

Please contact Adrienne Gerard, IMAPS Marketing Communications at agerard@imaps.org