3D and Systems Summit – SEMI Europe

Amkor Technology invites you to join us at the 3D and Systems Summit – SEMI Europe on January 28-30, 2018 in Dresden, Germany.

Tues. Jan 29th, Session 5: 5G Session, 16:45-17:10

Heterogeneous Integration – the Future of Packaging“, Steffen Kroehnert, Sr Director – Technology Development.

Amkor will be exhibiting at Booth #14 with our packaging experts on hand to answer questions and discuss your IC packaging needs.

When: January 28, 2019 - January 30, 2019 Where: Dresden Hilton Hotel Location: Dresden, Germany

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