3D 및 Systems Summit – SEMI Europe

Amkor Technology invites you to join us at the 3D and Systems Summit – SEMI Europe on January 28-30, 2018 in Dresden, Germany.

Tues. Jan 29th, Session 5: 5G Session, 16:45-17:10

Heterogeneous Integration – the Future of Packaging“, Steffen Kroehnert, Sr Director – Technology Development.

Amkor will be exhibiting at Booth #14 with our packaging experts on hand to answer questions and discuss your IC packaging needs.

When: January 28, 2019 - January 30, 2019 Where: Dresden Hilton Hotel Location: Dresden, Germany

또 다른 이벤트

SEMI – 2021년 한국 반도체 소재 컨퍼런스

TSMC 2021 온라인 기술 심포지엄

2021년 전자 부품 및 기술 박람회(ECTC)