16th International Conference and Exhibition on Device Packaging
Amkor Technology invites you to join us at IMAPS DPC in Fountain Hills, Arizona at the WekoPa Resort and Casino on March 2-5, 2019.
IMAPS DPC is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields.
Amkor will participate in the following:
TUESDAY, MARCH 3, 2020
“Design Process & Methodology for Achieving High-Volume Production Quality for HDFO Packaging”
Ruben Fuentes, Vice President, Design Center, Amkor Technology, Inc. (Keith Felton, Mentor, a Siemens Business)
“Achieving Success in Automotive Leadframe Packages”
John Nickelsen, VP, Product Engineering, Amkor Technology, Inc.
“Thermal Management Implications for Heterogeneous Integrated Packaging”
Cameron Nelson, Manager, Thermal Engineer, Amkor Technology, Inc.
“The New Technology Solutions for Advanced SiP Devices”
YongJai Seo, Director, SiP Development, Amkor Technology, Inc.
3:00-3:30 PM – “Enhancing the Punch MLF®/QFN Package for Improved Robustness in Automotive Applications”
Marc Mangrum, Director – MLF Products, Amkor Technology, Inc.
“Thin Quad Die Package (QDP) Development”
Shaun Bowers, VP, Mainstream Advanced Package Integration, Amkor Technology, Inc.
WEDNESDAY, MARCH 4, 2020
“Heterogeneous Packaging, Chiplets and the Quest for Higher Performance”
Mike Kelly, VP, Adv Package & Technology Integration, Amkor Technology, Inc. (Dave Hiner, Curtis Zwenger, George Scott, Ron Huemoeller)
“Thermal Cycling of Aerosol Jet® Printed Silver Interconnects”
Kurt Christneson, Optomec (Patrick Welch, Shaun Bowers, Knowlton Olmstead – Amkor Technology, Inc.)
Amkor Session Chairs
3D Integration Track
Application & Design, Chair: Vik Chaudhry, Sr Director, Product Marketing and Business Development
Technology – Organic & Silicon Based 3D, Chair: Suresh Jayaraman, Sr Director, Package Development
Fan-out, Wafer Level Packaging & Flip Chip Track
Advances In Process, Materials and Equipment for Fan-out Wafer Level Packaging, Chair: Curtis Zwenger, VP, Adv Package & Technology Integration
Advanced & Emerging Materials for Automotive, 5G & Next Gen Applications Track
Automotive Packaging Trends, Chair: Prasad Dhond, VP and General Manager, Automotive Segment
Automotive and 5G SIPs, Chair: Bora Baloglu, Director, Package Development
Amkor will be exhibiting at booth #38 with our packaging experts on hand to answer questions and discuss your IC packaging needs.