16th International Conference and Exhibition on Device Packaging

Amkor Technology invites you to join us at IMAPS DPC in Fountain Hills, Arizona at the WekoPa Resort and Casino on March 2-5, 2019.

IMAPS DPC is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields.

Amkor will participate in the following:


10:30-11:00 AM
“Design Process & Methodology for Achieving High-Volume Production Quality for HDFO Packaging”
Ruben Fuentes, Vice President, Design Center, Amkor Technology, Inc. (Keith Felton, Mentor, a Siemens Business)

11:00-11:30 AM
“Achieving Success in Automotive Leadframe Packages”
John Nickelsen, VP, Product Engineering, Amkor Technology, Inc.

12:00-12:30 PM
“Thermal Management Implications for Heterogeneous Integrated Packaging”
Cameron Nelson, Manager, Thermal Engineer, Amkor Technology, Inc.

2:00-2:30 PM
“The New Technology Solutions for Advanced SiP Devices”
YongJai Seo, Director, SiP Development, Amkor Technology, Inc.

3:00-3:30 PM – Enhancing the Punch MLF®/QFN Package for Improved Robustness in Automotive Applications
Marc Mangrum, Director – MLF Products, Amkor Technology, Inc.

4:30-5:00 PM
“Thin Quad Die Package (QDP) Development”
Shaun Bowers, VP, Mainstream Advanced Package Integration, Amkor Technology, Inc.


1:30-2:00 PM
“Heterogeneous Packaging, Chiplets and the Quest for Higher Performance”
Mike Kelly, VP, Adv Package & Technology Integration, Amkor Technology, Inc. (Dave Hiner, Curtis Zwenger, George Scott, Ron Huemoeller)

5:30-6:30 PM
“Thermal Cycling of Aerosol Jet® Printed Silver Interconnects”
Kurt Christneson, Optomec (Patrick Welch, Shaun Bowers, Knowlton Olmstead – Amkor Technology, Inc.)

Amkor Session Chairs

3D Integration Track
Application & Design, Chair: Vik Chaudhry, Sr Director, Product Marketing and Business Development
Technology – Organic & Silicon Based 3D, Chair: Suresh Jayaraman, Sr Director, Package Development

Fan-out, Wafer Level Packaging & Flip Chip Track
Advances In Process, Materials and Equipment for Fan-out Wafer Level Packaging, Chair: Curtis Zwenger, VP, Adv Package & Technology Integration

Advanced & Emerging Materials for Automotive, 5G & Next Gen Applications Track
Automotive Packaging Trends, Chair: Prasad Dhond, VP and General Manager, Automotive Segment
Automotive and 5G SIPs, Chair: Bora Baloglu, Director, Package Development

Amkor will be exhibiting at booth #38 with our packaging experts on hand to answer questions and discuss your IC packaging needs.

When: March 2, 2020 - March 5, 2020 Where: Fountain Hills, Arizona Location: WekoPa Resort and Casino

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