イベント

16th International Conference and Exhibition on Device Packaging

Amkor Technology invites you to join us at IMAPS DPC in Fountain Hills, Arizona at the WekoPa Resort and Casino on March 2-5, 2019.

IMAPS DPCは、IMAPS（International Microelectronics Assembly and Packaging Society）が組織する国際的なイベントです。この会議は、知識交換のための主要なフォーラムであり、これらの分野の第一人者と交流を深めるための技術的、社会的、ネットワーキングの機会を多数提供します。

Amkorは次のイベントに参加します：

TUESDAY, MARCH 3, 2020

10:30-11:00 AM
“Design Process & Methodology for Achieving High-Volume Production Quality for HDFO Packaging”
Ruben Fuentes, Vice President, Design Center, Amkor Technology, Inc. (Keith Felton, Mentor, a Siemens Business)

11:00-11:30 AM
“Achieving Success in Automotive Leadframe Packages”
John Nickelsen, VP, Product Engineering, Amkor Technology, Inc.

12:00-12:30 PM
“Thermal Management Implications for Heterogeneous Integrated Packaging”
Cameron Nelson, Manager, Thermal Engineer, Amkor Technology, Inc.

2:00-2:30 PM
“The New Technology Solutions for Advanced SiP Devices”
YongJai Seo, Director, SiP Development, Amkor Technology, Inc.

3:00-3:30 PM – “Enhancing the Punch MLF^®/QFN Package for Improved Robustness in Automotive Applications”
Marc Mangrum, Director – MLF Products, Amkor Technology, Inc.

4:30-5:00 PM
“Thin Quad Die Package (QDP) Development”
Shaun Bowers, VP, Mainstream Advanced Package Integration, Amkor Technology, Inc.

WEDNESDAY, MARCH 4, 2020

1:30-2:00 PM
“Heterogeneous Packaging, Chiplets and the Quest for Higher Performance”
Mike Kelly, VP, Adv Package & Technology Integration, Amkor Technology, Inc. (Dave Hiner, Curtis Zwenger, George Scott, Ron Huemoeller)

5:30-6:30 PM
“Thermal Cycling of Aerosol Jet^® Printed Silver Interconnects”
Kurt Christneson, Optomec (Patrick Welch, Shaun Bowers, Knowlton Olmstead – Amkor Technology, Inc.)

Amkor Session Chairs

3D Integration Track
Application & Design, Chair: Vik Chaudhry, Sr Director, Product Marketing and Business Development
Technology – Organic & Silicon Based 3D, Chair: Suresh Jayaraman, Sr Director, Package Development

Fan-out, Wafer Level Packaging & Flip Chip Track
Advances In Process, Materials and Equipment for Fan-out Wafer Level Packaging, Chair: Curtis Zwenger, VP, Adv Package & Technology Integration

Advanced & Emerging Materials for Automotive, 5G & Next Gen Applications Track
Automotive Packaging Trends, Chair: Prasad Dhond, VP and General Manager, Automotive Segment
Automotive and 5G SIPs, Chair: Bora Baloglu, Director, Package Development

Amkor will be exhibiting at booth #38 with our packaging experts on hand to answer questions and discuss your IC packaging needs.