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Road to Chiplets – Ecosystems 2023

Amkor Technology invites you to join us at the MEPTEC Road to Chiplets – Ecosystems 2023 event on Wednesday, November 29 at the SEMI HQ in Milpitas, California. Vineet Pancholi, Sr Director, Test Technology at Amkor will present “Production Test Ecosystem – Test Road to 3DIC Chiplet Integration.”

摘要

The chiplet-based design adds new issues to the testing process.  With standards like the Universal Chiplet Interconnect Express (UCIe^TM) standards emerging, the complete chiplet ecosystem is dynamically getting architected, implemented, and deployed, within the manufacturing workflow. Tests must cover individual chiplets, the interconnections among them, and the entire package.  Depending on the design complexity, testing could significantly increase time-to-market.  How can developers keep such effects at a tolerable and affordable level? What are the test considerations as chiplet integration continues into mainstream production? Is there any test design (DFT) methods available that, when included in the architecture will help with test coverage and simplify production testing? Does design and package resiliency play a role in optimal quality product introduction? What are the impacts of chiplet integration on the Automotive segment? EDA (Electronic Design Automation) companies and IEEE forums have significantly contributed and continue to contribute towards chiplet integration. Automation must be stressed, and new techniques such as agent-based monitoring must be evaluated.  Only a thorough integration of test with the entire development process will do the job. Manufacturing test flows must be altered for the most optimal test coverage. System Level Test (SLT) will continue to play a vital role in Manufacturing Test Flows. Content re-distribution in each test step may be necessary.