活动

ISIG 中国台湾高层峰会

Amkor will be attending the ISIG Executive Summit Taiwan, a senior‑level forum that brings together semiconductor executives and technology leaders from across the Asia‑Pacific region. The summit focuses on strategic and technical discussions covering advanced manufacturing, packaging innovation, supply chain collaboration, and the evolving demands of high‑performance and heterogeneous integration.

Amkor team members will be on-site throughout the two‑day event, engaging with industry peers and partners across the semiconductor ecosystem.

We welcome the opportunity to connect and discuss how Amkor’s advanced packaging and test expertise can support your technology roadmap and business objectives.