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ISES Taiwan 2025

Amkor Technology invites you to join us at the ISES Taiwan 2025 on May 13-14 in Taipei, Taiwan. Amkor is a proud sponsor of this event.

Walter Chen, SVP, Greater China Sales & Marketing, will present “Semiconductor Packaging Technologies in AI”

摘要：

Semiconductor packaging technologies are revolutionizing the AI landscape. This presentation examines how these critical innovations enable AI advancement while responding to 5G, edge computing, and automotive market demands. We’ll trace semiconductor technology’s evolution toward AI-optimized computing, focusing on breakthrough packaging approaches, including chiplet architecture, heterogeneous integration, and co-packaged optics. These solutions are becoming indispensable for both data center AI and edge computing deployments. The discussion concludes by addressing technical hurdles and future development pathways for semiconductor packaging in AI applications.