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IMAPS CHIPcon

Amkor Technology will participate in IMAPS CHIPcon 2026, a valuable forum for collaboration across the semiconductor ecosystem, with a focus on enabling next-generation applications in AI, high-performance computing, and advanced microelectronics. The event will take place on July 6–8, 2026, at the Hyatt Regency Santa Clara in Santa Clara, California.

As part of the conference program, David McCann, Senior Vice President, Business Unit & Amkor Technology Arizona Project Executive, will present “Building a U.S. Advanced Packaging and Test Ecosystem for Chiplets and AI.” The session will examine the opportunities and challenges associated with developing a secure domestic semiconductor supply chain from an OSAT perspective, highlight progress on Amkor’s Advanced Packaging and Test Campus in Peoria, Arizona, and discuss the advanced packaging and test technologies that are planned for Amkor Technology Arizona.

Through collaboration with customers, industry partners, and technology leaders, Amkor continues to drive innovation in advanced packaging and test technologies, support the development of a resilient semiconductor ecosystem, and strengthen the future of semiconductor manufacturing while advancing what’s next.