Amkor Technology invites you to join us at ECTC 2018 on May 29 – June 1 in San Diego, California at the Sheraton San Diego Hotel & Marina. ECTC is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.
Thursday, May 31, 2018, Session 13: Fan-Out and Interposer Interconnections
WonMyoung Ki, Manager – Process Research at Amkor, will be presenting “Chip Stackable, Ultra-thin, High-flexibility 3D FOWLP (3D SWIFT®) for Hetero-integrated Advanced 3D WL-SiP”
Thursday, May 31, 2018, Session 40: Posters 4
Poster Session – “Practical Design Method to Reduce Crosstalk for Silicon Wafer Integrated Fan-out Technology (SWIFT®) Packages” – HoJeong Lim, Director – Package Design at Amkor.
Friday, June 01, 2018, Session 32: Heterogeneous Integration
Eoin O’ Toole, R&D Integrator at Amkor, will be presenting “Heterogeneous Integration Challenges within Wafer Level Fan-Out SiP for Wearables and IoT”
Amkor will be exhibiting at this event in booth #401 with our packaging experts on hand to answer questions and discuss your IC packaging needs.