活动

2019 Conference and Exhibition on Advanced SiP Technology

SiP 2019 is a continuation of IMAPS SiP Conference which first started in June 2017 as the first System-in-Package (SiP) conference fully dedicated to covering all aspects related to SiPs – market trends, system integration/miniaturization, and new technology innovation enablers to meet current and future SiP challenges. This conference will bring the entire SiP supply and design chain from OEM, Fabless, IDM, OSAT, EMS, EDA, silicon foundries, equipment, and material suppliers together under one roof.

TUESDAY MORNING SESSION

KEYNOTES AND MARKETING & TECHNOLOGY TRENDS
8:00am-8:45am – Welcome & Conference Chair Opening + “System in Package Solutions for 5G Technology Needs”
General Chair: Nozad Karim, VP, Amkor Technology

WEDNESDAY EARLY AFTERNOON SESSIONS
4:15pm-4:45pm – “Heterogeneous Integration, 2.5D TSV, and Beyond”, Rick Reed, Director, Development, Amkor Technology, Inc.

THURSDAY MORNING PANEL SESSION
10:30am-12:00pm

This panel session will address the increasingly complex problems of design and simulation tools for heterogeneous systems, especially for packages including advanced CMOS (e.g., 7 or 5nm), III-V (SiGe, etc) as well as conventional analog nodes. The panelists will also address testing (ATE, System test) for packages including optical and high-speed SERDES, HBM memory

专家组成员：
Gerard John, Amkor Technology
Dave Adler, SVXR
Vincent Liao, ASE
Humair Mandavia, Zuken
John Park, Cadence

Amkor is a premier sponsor and will be exhibiting at this event with our packaging experts on hand to answer questions and discuss your IC packaging needs.