活动

16th International Conference and Exhibition on Device Packaging

Amkor Technology invites you to join us at IMAPS DPC in Fountain Hills, Arizona at the WekoPa Resort and Casino on March 2-5, 2019.

IMAPS DPC 是由国际微电子组装与封装协会 (IMAPS) 组织的国际性活动。该会议是供相关领域的主要专家交换信息，并且提供各种技术、社交和结识人脉机会的重要平台。

Amkor 将参加以下活动：

TUESDAY, MARCH 3, 2020

10:30-11:00 AM
“Design Process & Methodology for Achieving High-Volume Production Quality for HDFO Packaging”
Ruben Fuentes, Vice President, Design Center, Amkor Technology, Inc. (Keith Felton, Mentor, a Siemens Business)

11:00-11:30 AM
“Achieving Success in Automotive Leadframe Packages”
John Nickelsen, VP, Product Engineering, Amkor Technology, Inc.

12:00-12:30 PM
“Thermal Management Implications for Heterogeneous Integrated Packaging”
Cameron Nelson, Manager, Thermal Engineer, Amkor Technology, Inc.

2:00-2:30 PM
“The New Technology Solutions for Advanced SiP Devices”
YongJai Seo, Director, SiP Development, Amkor Technology, Inc.

3:00-3:30 PM – “Enhancing the Punch MLF^®/QFN Package for Improved Robustness in Automotive Applications”
Marc Mangrum, Director – MLF Products, Amkor Technology, Inc.

4:30-5:00 PM
“Thin Quad Die Package (QDP) Development”
Shaun Bowers, VP, Mainstream Advanced Package Integration, Amkor Technology, Inc.

WEDNESDAY, MARCH 4, 2020

1:30-2:00 PM
“Heterogeneous Packaging, Chiplets and the Quest for Higher Performance”
Mike Kelly, VP, Adv Package & Technology Integration, Amkor Technology, Inc. (Dave Hiner, Curtis Zwenger, George Scott, Ron Huemoeller)

5:30-6:30 PM
“Thermal Cycling of Aerosol Jet^® Printed Silver Interconnects”
Kurt Christneson, Optomec (Patrick Welch, Shaun Bowers, Knowlton Olmstead – Amkor Technology, Inc.)

Amkor Session Chairs

3D Integration Track
Application & Design, Chair: Vik Chaudhry, Sr Director, Product Marketing and Business Development
Technology – Organic & Silicon Based 3D, Chair: Suresh Jayaraman, Sr Director, Package Development

Fan-out, Wafer Level Packaging & Flip Chip Track
Advances In Process, Materials and Equipment for Fan-out Wafer Level Packaging, Chair: Curtis Zwenger, VP, Adv Package & Technology Integration

Advanced & Emerging Materials for Automotive, 5G & Next Gen Applications Track
Automotive Packaging Trends, Chair: Prasad Dhond, VP and General Manager, Automotive Segment
Automotive and 5G SIPs, Chair: Bora Baloglu, Director, Package Development

Amkor will be exhibiting at booth #38 with our packaging experts on hand to answer questions and discuss your IC packaging needs.