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Amkor Technology has entered into a Strategic Partnership with Intel focused on Embedded Multi-Die Interconnect Bridge (EMIB) assembly. This collaboration aims to enhance the availability of the EMIB technology ecosystem and significantly expand Advanced Packaging capacity in Korea, Portugal and the United States.

The partnership represents a significant milestone in the semiconductor industry’s push to strengthen domestic supply chains for critical packaging technologies. EMIB technology, developed by Intel, enables high-density interconnects between multiple semiconductor dies in a package, offering performance advantages while minimizing manufacturing complexity compared to traditional silicon interposers.

Through this agreement, Amkor will implement EMIB assembly processes at its Korea, Portugal and upcoming Arizona manufacturing facilities, creating a robust alternative source for this advanced packaging solution. The collaboration addresses growing market demand for heterogeneous integration solutions that support high-performance computing, artificial intelligence, and other data-intensive applications.

Watch Amkor’s COO, Kevin Engel, announce the new partnership at Intel’s Direct Connect 2025 Keynote.