Amkor Virtual Booth

Thank you for visiting our booth!

Explore our cutting-edge packaging solutions through our latest datasheets and brochures.

A proud legacy. An exciting future!

Where technology, capacity and service come together to enable the future of electronics

If you can build it, Amkor can test it!

Amkor – the world’s largest OSAT for automotive ICs

Enabling high-performance, cost-effective integration of multiple chiplets and memories

Increase integration with a reduced footprint

Ideal solutions for low cost integration at a smaller size

Solutions for high performance and functionality

Design flexibility for a wide range of end applications

Flexibility to enable 3D multi-component package designs

Enable higher semiconductor content in a high performing, small sized package

Cutting-edge solutions for 5G applications

Contact an Amkor expert by clicking the request info button below.

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