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Explore our cutting-edge packaging solutions through our latest datasheets and brochures.

Corporate Brochure

Where technology, capacity and service come together to enable the future of electronics

Product Line Card

Where technology, capacity and service come together to enable the future of electronics

Test Brochure

If you can build it, Amkor can test it!

Automotive Brochure

Amkor – the world’s largest OSAT for automotive ICs

S-SWIFT™ Data Sheet

Enabling high-performance, cost-effective integration of multiple chiplets and memories

SWIFT® Data Sheet

Increase integration with a reduced footprint

SiP Data Sheet

Ideal solutions for low cost integration at a smaller size

2.5D TSV Data Sheet

Solutions for high performance and functionality

Memory & Storage

Amkor is a market leader in providing innovative packaging and test services to the memory IC market

MEMS & Sensors

Amkor Technology is a top OSAT for MEMS and optical sensor packaging and test services

DSMBGA Data Sheet

Double Sided Molded BGA allows molded assembly of components on both sides of the substrate

FCBGA Data Sheet

Design flexibility for a wide range of end applications

WLFO Data Sheet

Flexibility to enable 3D multi-component package designs

WLCSP Data Sheet

Enable higher semiconductor content in a high performing, small sized package

AiP/AoP Data Sheet

Cutting-edge solutions for 5G applications

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