TSMC 2024 OIP Ecosystem Forum – China
Amkor Technology invites you to join us at the TSMC 2024 Open Innovation Platform Ecosystem Forum – China on Wednesday, November 13 from 9:30 AM – 4:35 PM in Beijing at the Hyatt Regency Beijing Wangjing.
Amkor will be exhibiting with our packaging experts on hand to answer questions and discuss your IC packaging and test needs.
When: November 13, 2024
Where: Hyatt Regency Beijing Wangjing
Location: Beijing, China
More Upcoming Events
ICCAD 2024
