SiP Conference China 2021
Amkor Technology invites you to join us at SiP Conference China 2021 on September 28-29 at the Shenzhen World Exhibition & Convention Center in Shenzhen, China.
Amkor is a proud premier sponsor of this event.
Robert Lanzone, Sr. VP – System in Package at Amkor will present “New Challenges in System in Package (SiP) Miniaturization.”
Nozad Karim, VP – SiP Engineering at Amkor, is the General Chair and will deliver opening and closing remarks at the conference.