SiP Conference China 2021

Amkor Technology invites you to join us at SiP Conference China 2021 on September 28-29 at the Shenzhen World Exhibition & Convention Center in Shenzhen, China.

Amkor is a proud premier sponsor of this event.

Robert Lanzone, Sr. VP – System in Package at Amkor will present “New Challenges in System in Package (SiP) Miniaturization.”

Nozad Karim, VP – SiP Engineering at Amkor, is the General Chair and will deliver opening and closing remarks at the conference.

When: September 28, 2021 - September 29, 2021 Where: Shenzhen, China Location: Shenzhen World Exhibition & Convention Center

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