InterPACK 2020
Join Amkor Technology at the upcoming InterPACK 2020 virtual conference on October 27-29, 2020.
Amkor will be presenting a joint paper with Fraunhofer ENAS and Besi.
“The Systematic Study Of Fan-out Wafer Warpage Using Analytical, Numerical, and Experimental Methods”
Ghanshyam Gadhiya, Sven Rzepka, Thomas Otto – Fraunhofer ENAS
Sebastiaan Kersjes – Besi Netherlands B.V.
Felandorio Fernandes – Amkor Technology Portugal, S.A.
When: October 27, 2020 - October 29, 2020
Where: VIRTUAL
Location: VIRTUAL
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