InterPACK 2020

Join Amkor Technology at the upcoming  InterPACK 2020 virtual conference on October 27-29, 2020.

Amkor will be presenting a joint paper with Fraunhofer ENAS and Besi.

The Systematic Study Of Fan-out Wafer Warpage Using Analytical, Numerical, and Experimental Methods

Ghanshyam Gadhiya, Sven Rzepka, Thomas Otto – Fraunhofer ENAS
Sebastiaan Kersjes – Besi Netherlands B.V.
Felandorio Fernandes – Amkor Technology Portugal, S.A.

When: October 27, 2020 - October 29, 2020 Where: VIRTUAL Location: VIRTUAL

More Upcoming Events

ISMP 2021

Road to Chiplets – Data & Test

CSIA-ICCAD 2021