Events

IEMT 2026

Amkor Technology will participate in IEMT Conference 2026, a premier global forum focused on advances in electronic materials, packaging technologies and manufacturing processes. The event will take place on October 14-16, at Le Méridien Putrajaya in Selangor, Malaysia. The conference brings together industry leaders, researchers and technology innovators to address emerging challenges in semiconductor packaging and advanced manufacturing.

Amkor team members will present the following poster presentations highlighting advancements in semiconductor packaging, assembly processes and manufacturing technologies.

• Chin Joo Tan, Senior Engineer
  “Improving RDS(on) Stability of Copper Clip Bonded Devices via Effective Solder Clip Attach Criteria and Low Solder Joint Stress Inducing Epoxy Mold Compound”
  October 15, 3:30-3:50 p.m.| Session C2: Power Electronics & Power Packaging Technologies | C2.1, Poster ID 131
• Thaneeshkumar Krishnakumar, Engineer, Application
  “Nanosecond Pulse Fiber Laser Deflashing Approach for Superior Flash Removal and Minimal Copper Surface Impact”
  October 16, 10-10:30 a.m.| Poster Session 3 | P3:15, Poster 191
• Revathi Manivanan, Engineer, Application
  “Mitigation of Sidewall Damage in Thin Silicon Wafers Through Step-Cut Dicing Optimization”
  October 16, 10-10:30 a.m. | Poster Session 3 | P3:3, Poster 192
• Siang Miang Yeo, Acting Manager
  “High-Speed Dicing of Thick Silicon Wafers With Ultra-Narrow Saw Streets via Integrated Blade Engineering and RSM Optimization”
  October 16, 10-10:30 a.m.| Poster Session 3 | P3:2, Poster 135
• Mahenthren Palaniappan, Engineer
  “Flux Intrusion Mitigation Through Enhanced Heater Plate Design in Reflow Process of Semiconductor Assembly”
  October 16, 10-10:30 a.m. | Poster Session 3 | P3:8, Poster 139
• Chin Joo Tan, Senior Engineer
  “A Facile and Robust Adhesion Promoter Spray Coating Process for Zero Interfacial Delamination in Automotive Power Electronics Assembly”
  October 16, 3-3:30 p.m. | Poster Session 4 | P4:7, Poster 130

As a global leader in semiconductor packaging and test services, Amkor is committed to advancing power packaging innovation and sharing technical expertise with the engineering community while advancing what’s next.