Join Amkor Technology at China Semiconductor Assy & Test (CSPT) Technology and Market Annual Meeting on October 25-27, 2023 at the Kunshan Crown International Exhibition Hotel in Kunshan, China.
Jianmin Li, Director R&D at Amkor China will present “Automotive Semiconductor Packaging-Market & Technology Dynamics.”
Autonomous driving is expected to change the human transportation model and rebuild the entire automotive industry economy. With the upcoming 2020~2023 SAE Level 3 implementation in automakers’ timelines, a significant increase in ADAS semiconductor content demand can be expected. This will drive hardware system architectural evolution and demand for various new chips, including mmWave radar, sensor fusion chips, real-time processing of an enormous volume and variety of vision and radar data, domain control units integrating numerous ECUs, heterogeneous chip hardware solutions, and more.
With more than 40 years of automotive package assembly and test experience, Amkor offers advanced packages including fcCSP, FCBGA, SiP and Low- and High-Density Fan-Out (HDFO) to support customers in these emerging applications. As the leading automotive OSAT, Amkor provides turnkey solutions including design, process and test to satisfy strict automotive device qualifications by using dedicated production lines with special production control plans.