Road to Chiplets – Architecture 2021

Amkor Technology is a proud sponsor of MEPTEC’s free online event Road to Chiplets – Architecture 2021 on July 13-14, 2021. Road to Chiplets – Architecture will focus on the high-level decisions that need to be made to implement a product using a Chiplet approach.

Dave Hiner, Sr. Director, Package Development at Amkor will present on “Chiplets: Building Blocks and Future Packaging Trends” on July 13.

两场在线活动
星期二 July 13, 2021 太平洋夏令时间上午 8:00 – 11:00
星期三 July 14, 2021 太平洋夏令时间上午 8:00 – 11:00
When: July 13, 2021 - July 14, 2021 地点:虚拟 场地:虚拟

更多未来大事件

ISMP 2021

Road to Chiplets – Data & Test

CSIA-ICCAD 2021