活动

Chiplet Summit 2025

Amkor Technology invites you to the Chiplet Summit 2025 from January 21-23 at the Santa Clara Convention Center in Santa Clara, California. As a proud Bronze sponsor, we are excited to announce that Mike Kelly, our VP of Chiplets/FCBGA Integration, will speak in session E-102: “Best Packaging Methods for Your Application.”

半导体封装领域的多位杰出专家将参加本次会议，其中包括：

• Akshay Singh，Micron 先进封装技术开发副总裁
• Craig Bishop，Deca Technologies 首席技术官
• Chintan Buch，AMD 封装高级技术员
• Kenneth Larsen，Synopsys 产品管理总监

Rosalia Beica, Field CTO at Rapidus Design Technologies will moderate the discussion.

Roger St Amand, Corporate vice president of Chiplets/FCBGA, will present “Chiplet Packaging Basics.” This presentation will cover the fundamentals of chiplets and heterogeneous integration and highlight the high-level process flows of Amkor’s 2.5D, S-SWIFT™, and S-Connect™ package technologies.

Vineet Pancholi, Sr Director, Test Technology, will present “Best Practices for Testing 2.5D Chiplet Package Designs.” The presentation will focus on the need for comprehensive test integration throughout development and the continuing significance of system-level testing in manufacturing processes.